A Breakthrough Metal/Air-Gap Solution for Semiconductor Devices Beyond "2nm"
An Ideal Air-Gap Structure with Simplified Processing and Cost Efficiency
This innovative Metal/Air-Gap architecture enables the maximum achievable performance in metal interconnects, delivering unprecedented signal speed, significant power savings, and remarkable heat reduction—all essential for next-generation semiconductor devices.
Innovative Technology
Overcoming Dielectric Limits — With "Air".
Conventional low-k materials have reached their physical limits. Air, with a dielectric constant of ~1, offers the ultimate path forward.
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Innovative technology solutions
Explore Airgap SiliconTech's cutting-edge semiconductor processes designed to enhance performance and efficiency.
Advanced insulation techniques
Discover how Airgap SiliconTech's air gap technology reduces capacitance for superior chip performance.
Precision engineering
Airgap SiliconTech's commitment to precision ensures the highest quality in semiconductor manufacturing.
Revolutionizing the industry
Join Airgap SiliconTech in transforming the semiconductor landscape with groundbreaking advancements.
Academic Validation
Breakthrough Air-gap Process Innovation
First public disclosure of an air-gap formation process based on electrospinning technology
Scalable for the Future of Semiconductor Nodes
Demonstration of a scalable structure applicable to sub-10nm technology nodes.